Two pictures of a person working on micro assembly.

About Advanced International Technology

Rapid Turnaround Solutions for Dicing and Micro
Assembly Services

Advanced International Technology LLC specializes in high-quality wafer processing and dicing, micro-assembly, and fabrication services, providing clients with the highest degree of precision machining and engineering for the greatest possible value.

Our experts perform dicing services for a wide range of substrate materials, ranging from silicon to fused silicon, glass, ceramic, and more. In addition to dicing, our innovative approaches to wire bonding allow us to complete wedge bonding, ball bonding, and die bonding for customized assembly of microelectronics.

With applications in data storage, biotechnology, MEMS, and nanotechnology, Advanced International Technology’s engineering and manufacturing solutions assist numerous industries in achieving success with exceptional products.