Advanced International Technology provides specialized back-end wafer processing, micro assembly, and fabrication services. Prototyping and small to medium builds are our specialty.
Specializing in Wafer Processing & Dicing
Advanced International Technology LLC provides specialized back-end wafer processing, micro-assembly, and fabrication services. Prototyping and small to medium builds are our specialty.
About Advanced International Technology
Rapid Turnaround Solutions
for Dicing and Micro
Assembly Services
Advanced International Technology LLC specializes in high-quality wafer processing and dicing, micro-assembly, and fabrication services, providing clients with the highest degree of precision machining and engineering for the greatest possible value.
Our experts perform dicing services for a wide range of substrate materials, ranging from silicon to fused silicon, glass, ceramic, and more. In addition to dicing, our innovative approaches to wire bonding allow us to complete wedge bonding, ball bonding, and die bonding for customized assembly of microelectronics.
With applications in data storage, biotechnology, MEMS, and nanotechnology, Advanced International Technology’s engineering and manufacturing solutions assist numerous industries in achieving success with exceptional products.