Our wafer dicing service utilizes a Disco DFD 651 Automatic Dicing Saw. The dual spindle with revolutions up to 60,000 RPM allow for quick dicing reducing the time it takes to dice a wafer and ultimately cost. This machine can handle substrates up to 25 x 8″ rounds at a time.
Typical substrate materials that we work with include Silicon, Quartz, Glass, Sapphire, CaF2, and Ceramics such as Aluminum Oxide,Al2O3, MnO, AlN, etc. PCB’s can also be cut on our machines where extreme tolerances are required.
Please have the following information available to expedite quotations:
- Number of streets — Both X and Y
- Street size — Our standard blades for silicon cut approximately 60 um including chipping
- Chipping spec — Chipping depends on coating surface, cutting parameters and blade type
- Size of substrate — Diameter and thickness
- Substrate Material
For more information about the superior results our dicing services can achieve, we invite you to call us at +1 858-566-2945
or submit an inquiry via our web form