Micro Assembly Services
We have a new process that allows us to wire bond many devices at ambient temperature. This allows gold ball wire bonding to parts that are heat sensitive such as gold plated plastic, magnetic structures, populated PCB’s, etc.
Our wire bonding service utilizes a manual digital ball bonder. Bondable substrates include platinum, gold and aluminum. Copper can be bonded on a prototype and small volume basis but is not considered a permanent solution. We specialize in small batch processing and are experienced with unusual wire bonding applications.
To learn more about how Advanced International Technology can assist your organization with high-precision micro assembly and wire bonding services, please call us at +1 858-566-2945 or submit an inquiry via our web form.